| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent moisture heat resistance, exhibiting a high elastic modulus of a cured product at high temperature and excellent hollow structure retaining property, and to provide a photosensitive film, a method for forming a rib pattern, a method for forming a hollow structure, and an electronic component using the composition. <P>SOLUTION: The photosensitive resin composition to be used for a rib material or a cap material having a hollow structure in an electronic component having the hollow structure contains (A) a heat-crosslinking compound, (B) a photopolymerizable compound having at least one ethylenically unsaturated group, and (C) a photopolymerization initiator. The content of the (A) heat-crosslinking compound is 10 to 40 parts by mass when the total amount of the (A) heat-crosslinking compound having condensation reactivity and the (B) photopolymerizable compound having at least one ethylenically unsaturated group is 100 parts by mass. A photosensitive film is obtained from the photosensitive resin composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
