| 摘要 |
Disclosed is an LED-inspecting device which comprises: an inspecting unit configured to inspect a wafer on which an LED is disposed; an unloading unit configured to classify and to load an LED from the wafer which has been completely inspected, wherein the inspecting unit and the unloading unit are divided into and provided on a plurality of layers; and a moving unit which moves the wafer across the inspecting unit and the unloading unit. As described above, the LED-inspecting device having the plurality of layers formed therein, can be reduced in size and width thereof, so that it is possible to increase the number of inspection devices that can be installed in a space where inspection devices are installed. In addition, as the number of inspection devices which can be installed increases, it is possible to increase the production of LEDs. |
