METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of preventing voids occurring between a base such as a substrate and a semiconductor chip.

SOLUTION: A semiconductor device 100 comprises: a semiconductor chip 5 in which electrode pads 17 are formed on a first major surface 5a and an adhesive layer 3 is provided on a second major surface 5b; and a substrate 12 for mounting a semiconductor chip. A method of manufacturing the semiconductor device 100 comprises the steps of: applying a fillet-forming material 13a to a portion contacting the outer edges of the second major surface of the semiconductor chip on the surface of the substrate; and bonding the second major surface of the semiconductor chip to the substrate via the adhesive layer.

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