发明名称 THERMOELECTRIC MODULE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermoelectric module and its manufacturing method. <P>SOLUTION: A thermoelectric module includes: first and second substrates 110a and 110b provided to face each other with a distance therebetween; first and second electrodes 120a and 120b provided for inner side surfaces of the first and second substrates 110a and 110b, respectively; a thermoelectric element 130 interposed between the first and second electrodes 120a and 120b and bonded thereto electrically; and a hybrid filling material 140 interposed between the first substrate 110a and the second substrate 110b and including a high-temperature part filling material adjacent to the substrate on the high-temperature end side that absorbs the heat and a low-temperature part filling material adjacent to the substrate on the low-temperature end side that releases the heat among the first and second substrates 110a and 110b. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012049546(A) 申请公布日期 2012.03.08
申请号 JP20110186017 申请日期 2011.08.29
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM YOUNG SUK;LEE SUNG HO;OH YEONG SU;GU TAE GWON
分类号 H01L35/32;H01L35/34;H02N11/00 主分类号 H01L35/32
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