发明名称 |
THERMOELECTRIC MODULE AND ITS MANUFACTURING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermoelectric module and its manufacturing method. <P>SOLUTION: A thermoelectric module includes: first and second substrates 110a and 110b provided to face each other with a distance therebetween; first and second electrodes 120a and 120b provided for inner side surfaces of the first and second substrates 110a and 110b, respectively; a thermoelectric element 130 interposed between the first and second electrodes 120a and 120b and bonded thereto electrically; and a hybrid filling material 140 interposed between the first substrate 110a and the second substrate 110b and including a high-temperature part filling material adjacent to the substrate on the high-temperature end side that absorbs the heat and a low-temperature part filling material adjacent to the substrate on the low-temperature end side that releases the heat among the first and second substrates 110a and 110b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012049546(A) |
申请公布日期 |
2012.03.08 |
申请号 |
JP20110186017 |
申请日期 |
2011.08.29 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KIM YOUNG SUK;LEE SUNG HO;OH YEONG SU;GU TAE GWON |
分类号 |
H01L35/32;H01L35/34;H02N11/00 |
主分类号 |
H01L35/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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