发明名称 Latent curing agent for epoxy resin and method for manufacturing the same
摘要 A latent epoxy resin curing agent is provided which exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, adduct particles formed through adduct reaction of an epoxy-based compound with the particulate imidazole-based compound are coated with an ethyl cellulose film. Furthermore, the surfaces of the adduct particles may be crosslinked with a polyfunctional isocyanate compound. A mixture of the epoxy-based compound, the particulate imidazole-based compound, and ethyl cellulose in a predetermined saturated hydrocarbon-based solvent is heated under stirring. Then, the epoxy-based compound and the particulate imidazole-based compound are subjected to adduct reaction to give a slurry of the adduct. After the slurry is cooled, the latent epoxy resin curing agent is filtrated.
申请公布号 US8128837(B2) 申请公布日期 2012.03.06
申请号 US20080078156 申请日期 2008.03.27
申请人 MASUKO DAISUKE;KOMURO KATSUHIKO;ITO MASAHIKO;KAWASHIMA TADASU;SONY CORPORATION;SONY CORPORATION & INFORMATION DEVICE CORPORATION 发明人 MASUKO DAISUKE;KOMURO KATSUHIKO;ITO MASAHIKO;KAWASHIMA TADASU
分类号 C09K3/00;C08G59/18;C08G59/68;C08L63/00 主分类号 C09K3/00
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