| 摘要 |
<P>PROBLEM TO BE SOLVED: To stably separate an electroformed body from a resin layer while suppressing surface roughening of the electroformed body. <P>SOLUTION: A method for manufacturing an electroformed component performs electroforming by using a molding die in which a resin layer 3 obtained by hardening a photosensitive material of a chemical amplification type is formed on a conductive layer of a substrate, thereby forming an electroformed body 5, then removes the substrate and the resin layer from the molding die. The method includes a first removal step of removing the substrate from the molding die, and a second removal step of removing the resin layer from the molding die. The second removal step includes a mixing step of mixing the molding die with a peeling agent 30 having sodium hydroxide 31 and potassium hydroxide 32 and not having at least one of compound containing sulfate group or nitrate group, and halogen compound, and a heating step of heating the peeling agent to a temperature of ≥150°C and ≤250°C after the mixing step, and melting the peeling agent. During the heating step, the molding die is kept immersed in the molten peeling agent. <P>COPYRIGHT: (C)2012,JPO&INPIT |
