| 摘要 |
An organic light emitting diode packaging structure and a manufacturing method thereof is provided. The organic light emitting diode packaging structure includes a substrate, an organic light emitting diode, a film, and a metal layer. The organic light emitting diode is disposed on the substrate. The film has a surface facing the substrate. The surface has a recess formed thereon. The metal layer is applied to the surface of the film, so that the metal layer forms an accommodating space in the recess to accommodate the organic light emitting diode. The present invention utilizes the metal layer to package the organic light emitting diode and therefore has the advantages of thinner in thickness and lighter in weight. As a result, the present invention can be applied to large organic light emitting diode products or portable electronic products.
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