发明名称 |
SEMICONDUCTOR DEVICE MODULE PACKAGE STRUCTURE AND SERIES CONNECTION METHOD THEREOF |
摘要 |
The invention provides a semiconductor device module package structure and a series connection method thereof. The semiconductor device module package structure includes a wafer having a plurality through holes. A doped layer covers a top surface of the first electrode, and inner sidewalls extending to a bottom surface of the first electrode. At least two first electrodes are disposed adjacent to each other and on opposite sides of the through holes. A second electrode covers the doped layer and the through holes. At least two insulating layer patterns overlap with the first and second electrodes. A second electrode conductive pattern is disposed on the second electrode. The second electrode conductive pattern is disposed between the insulating layer patterns, electrically connecting to the second electrode.
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申请公布号 |
US2012048355(A1) |
申请公布日期 |
2012.03.01 |
申请号 |
US20100982121 |
申请日期 |
2010.12.30 |
申请人 |
HSIEH HSIN-HSIN;HSI CHI-SHIUNG;CHANG TAO-CHIH;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
HSIEH HSIN-HSIN;HSI CHI-SHIUNG;CHANG TAO-CHIH |
分类号 |
H01L31/0248;H01L31/18 |
主分类号 |
H01L31/0248 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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