| 摘要 |
<P>PROBLEM TO BE SOLVED: To decrease heat resistance of a circuit board in a side emission LED device where the light-emitting direction becomes substantially parallel with a mother board when the LED device is mounted on the mother board, because heat dissipation efficiency is not improved only when an LED element is simply flip-chip mounted on the circuit board. <P>SOLUTION: A circuit board 13 comprises a recess 14 near the centerline (A-A line) of a connection surface for connection with a mother board 32. End of an electrode 34 formed in the recess 14 approaches an electrode 45 to be laminated on the emission layer of an LED element 12 and is connected thereto. The recess 14 is cut by a through hole 52 made through an aggregate circuit board 32 where the circuit board 13 is arranged when the circuit board 13 is individualized. Consequently, heat resistance from the emission layer, i.e. the heat generation source of the LED element 12, to the mother board 32 is decreased and heat dissipation efficiency is improved. <P>COPYRIGHT: (C)2012,JPO&INPIT |
