| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a manufacturing cost of a base for supporting a semiconductor laser without causing the fall of attaching accuracy of the semiconductor laser. <P>SOLUTION: An attaching member 53 is mounted between a base 38 supporting a semiconductor laser 31 and the semiconductor laser, and the semiconductor laser and the attaching member are bonded with a heat hardening type Ag paste 71. The Ag paste has a lower hardening temperature than a guarantee temperature of the semiconductor laser and a higher heat resistance temperature than an operation temperature of the semiconductor laser, and the attaching member is formed of a material having a higher heat resistance temperature than the hardening temperature of Ag paste. <P>COPYRIGHT: (C)2012,JPO&INPIT |
