发明名称 |
METAL FILM POLISHING LIQUID AND POLISHING METHOD |
摘要 |
<p>A metal film polishing liquid comprising, providing that the total amount of metal film polishing liquid is 100 wt.%, 7.0 wt.% or more of a metal oxidizing agent, a water-soluble polymer, an oxidized metal dissolving agent, a metal corrosion preventive agent and water. The water-soluble polymer has a weight average molecular weight of 150,000 or greater and is at least one member selected from among a polycarboxylic acid, a salt of polycarboxylic acid and a polycarboxylic ester. The metal film polishing liquid and polishing method using the same would realize high-speed polishing even under a low polishing load of 1 psi or less, excellence in the planarity of the film having undergone the polishing and high polishing speed from the initial stage of polishing operation.</p> |
申请公布号 |
WO2009008431(A1) |
申请公布日期 |
2009.01.15 |
申请号 |
WO2008JP62352 |
申请日期 |
2008.07.08 |
申请人 |
HITACHI CHEMICAL CO., LTD.;HAGA, KOUJI;FUKASAWA, MASATO;AMANOKURA, JIN;NAKAGAWA, HIROSHI |
发明人 |
HAGA, KOUJI;FUKASAWA, MASATO;AMANOKURA, JIN;NAKAGAWA, HIROSHI |
分类号 |
H01L21/304;B24B37/00 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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