| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal countermeasure structure of an electronic device, which protects a heat sensitive electronic component from heat in a small type electronic device. <P>SOLUTION: A housing outer wall 11 comprises multiple fins 12 integrally formed with the housing outer wall 11, and a housing 13 comprises an airtight heat insulating container 14 which is closely contacted with or is integrally formed with the housing outer wall 11 and is used for housing an electronic component. The heat insulating container 14 houses the electronic component such as a reference oscillator 15, which is sensitive to high temperature, for protecting the electronic component from heat emitted from a high temperature heat source, such as a power amplifier, in a device. Low temperature outside air is transmitted from the housing outer wall 11 to a wall of the heat insulating container 14, and the temperature increase is suppressed in the heat insulating container 14. Thus, the electronic component is protected from the heat. <P>COPYRIGHT: (C)2012,JPO&INPIT |
