Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same

摘要

A resin molding mold 20 with a cavity 21 has a resin injection port 29a from which a molding resin 25 is injected toward the cavity 21, and an air release port 30a from which air from the cavity 21 is released during resin injection. Not only the resin injection port 29a but also the air release port 30a is formed in a top surface portion 21a of the cavity 21. Thus, even if a resin burr remains in the resin injection port 29a or the air release port 30a, it can be prevented from adhering to an external terminal 4A provided on a front surface portion 2a of the substrate 2.