发明名称 |
Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same |
摘要 |
The silica film forming material of the present invention comprises a silicone polymer which comprises, as part of its structure, CHx, an Si—O—Si bond, an Si—CH3 bond and an Si—CHx- bond, where x represents an integer of 0 to 2. |
申请公布号 |
US8124239(B2) |
申请公布日期 |
2012.02.28 |
申请号 |
US20090640362 |
申请日期 |
2009.12.17 |
申请人 |
NAKATA YOSHIHIRO;YANO EI;FUJITSU LIMITED |
发明人 |
NAKATA YOSHIHIRO;YANO EI |
分类号 |
B32B9/04;B32B13/04;C08F2/46;C08J7/18;H01L21/31;H01L21/469 |
主分类号 |
B32B9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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