A method of fabricating an electrical contact through a through hole in a substrate, wherein the through hole is at least in part filled with a liquid conductive material and the solidified liquid conductive material provides an electrical contact through the through hole.
申请公布号
US8124521(B2)
申请公布日期
2012.02.28
申请号
US20070745145
申请日期
2007.05.07
申请人
HEDLER HARRY;IRSIGLER ROLAND;LEHMANN VOLKER;LEHMANN, LEGAL REPRESENTATIVE JUDITH;MEYER THORSTEN;TROVARELLI OCTAVIO;QIMONDA AG
