| 摘要 |
<p>An anti-scattering layer (50) for polishing pad windows as used in chemical-mechanical planarization (CMP) systems is disclosed. The invention finds particular use in circumstances where the windows (40) have a roughened lower surface (52). The anti-scattering layer (50) is formed over the roughened lower surface (52) of the window in a manner that significantly reduces light scattering while making optical in-situ measurements of a wafer undergoing a CMP process. The reduced light scattering results in an increased signal strength, which makes for more robust optical in-situ measurement capability. <IMAGE></p> |
