| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a die bonder and a semiconductor device manufacturing method which can achieve high-speed processing and high productivity. <P>SOLUTION: A semiconductor device manufacturing method includes: when a die paste for bonding a die to a substrate is coated from a discharge port 46t to a coating surface 45s, photographing a projected projection detection pattern from a vertical direction; storing reference image data which is the detection pattern photographed by an imaging means 41 irradiated from a projector 42 on a reference surface of a reference substrate, on which the paste is coated; calculating a shift amount between the reference image data and a projection image data which is the detection pattern photographed by the imaging means irradiated from the projector on the coating surface where the paste is coated on a substrate to be measured; measuring a height of the paste on the coating surface; and controlling a height of the discharge port from the coating surface based on the measured height. <P>COPYRIGHT: (C)2012,JPO&INPIT |
