发明名称 |
PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME |
摘要 |
Piezoelectric vibrating devices are disclosed that lack base through-holes and that can be manufactured on a wafer scale. Also disclosed are methods for making same. An exemplary piezoelectric device has a package base having first and second opposing main surfaces. On the second (outer) first main surface is formed a pair of external electrodes. The first (inner) main surface defines a first recess and a peripheral first bonding surface. A pair of connecting electrodes are provided for connecting to the respective external electrodes via respective edge surfaces of the package base that extend between the first and second main surfaces. A piezoelectric vibrating piece is mounted in and contained within the package base. The vibrating piece includes a pair of excitation electrodes electrically connected to respective connecting electrodes. A package lid comprises first and second main surfaces, of which the second (inner) main surface defines a second recess that is larger than the first recess. The second main surface also defines a second bonding surface that peripherally surrounds the second recess. A sealing material is applied, over the width of the second bonding surface, circumferentially between the first bonding surface and the second bonding surface. |
申请公布号 |
US2012043860(A1) |
申请公布日期 |
2012.02.23 |
申请号 |
US201113212030 |
申请日期 |
2011.08.17 |
申请人 |
ICHIKAWA RYOICHI;AMANO YOSHIAKI;NIHON DEMPA KOGYO CO., LTD |
发明人 |
ICHIKAWA RYOICHI;AMANO YOSHIAKI |
分类号 |
H01L41/053;H01L41/22 |
主分类号 |
H01L41/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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