发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 <p>Disclosed is a light emitting diode package (10a) which comprises: a frame (1a) that is provided in the form of a case; a pair of terminals (2a, 2b) that are provided apart from each other within the frame (1a) when viewed in plan and can be connected to the outside; a light emitting diode chip (3a) that is provided within the frame (1a) and connected to the pair of terminals (2a, 2b); and a transparent sealing member (5) that is provided within the frame (1a) and covers the light emitting diode chip (3a) and the pair of terminals (2a, 2b). The frame (1a) has a barrier portion (7a) that extends between the pair of terminals (2a, 2b) in a direction perpendicular to the direction in which the pair of terminals (2a, 2b) are separated from each other, and the barrier portion (7a) is provided with a step with respect to the surfaces of the pair of terminals (2a, 2b).</p>
申请公布号 WO2012023246(A1) 申请公布日期 2012.02.23
申请号 WO2011JP04301 申请日期 2011.07.28
申请人 SHARP KABUSHIKI KAISHA;MEMIDA, YUHICHI 发明人 MEMIDA, YUHICHI
分类号 H01L33/48 主分类号 H01L33/48
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