发明名称 FPD MODULE ASSEMBLY APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To reduce the probability of dust being attached to an electronic component of a TAB when the punched TAB is transferred to a target position. <P>SOLUTION: An FPD module assembly line is provided with a first punching part for punching a mounting member formed in a first carrier tape from a lower part. The upper part of the first punching part is provided with a first head mechanism part with a first delivery head which can suck a mounting member punched by the first punching part from the upper part. The first head mechanism part is fixed to the tip of a first rotational axis parallel to the width direction of the first carrier tape and rotates around the first rotational axis. When the first delivery head is at the upper position, the mounting member sucked by the first delivery head is sucked from the upper part and moved by a pickup device. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012033612(A) 申请公布日期 2012.02.16
申请号 JP20100170553 申请日期 2010.07.29
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 SUGIZAKI SHINJI;KATO MASAAKI
分类号 H01L21/60;G02F1/1345;H05K13/04 主分类号 H01L21/60
代理机构 代理人
主权项
地址