发明名称 LASER MACHINING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser machining apparatus, in which an optical component can be protected more properly. <P>SOLUTION: The laser machining apparatus 1 has a nozzle that generates flow of gas from a protection member side toward a machining point side in a space between a machining point and a protection member. The nozzle includes: a first flowing path part for guiding the gas to the circumference of an optical path of a laser beam condensed by a light collector; and a second flowing path part formed continuously with the first flowing path part, guiding the gas along the surface of the protection member from the circumference of the laser beam condensed by the light collector toward a center, and guiding the gas along the optical path of the laser beam condensed by the light collector from the protection member side toward the machining point side. The second flowing path part is formed by an inverted cone-shaped cavity where a flowing path diameter is gradually reduced from the protection member side toward the machining point side. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012030235(A) 申请公布日期 2012.02.16
申请号 JP20100169757 申请日期 2010.07.28
申请人 DISCO CORP 发明人 ODANAKA KENTARO;ENDO TOMOHIRO;FUKUOKA TAKEOMI
分类号 B23K26/14;B23K26/36;H01L21/301 主分类号 B23K26/14
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