WAFER PROCESSING TAPE AND SEMICONDUCTOR PROCESSING METHOD USING THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a wafer processing tape and a semiconductor processing method using thereof which can sufficiently prevent re-adhesion of semiconductor chips at a time of pickup.

SOLUTION: A dicing/die-bonding tape 10 as a wafer processing tape includes: a dicing tape 12 as an adhesive tape comprised of a support base material 12a and an adhesive layer 12b; and a thermosetting adhesive layer 13 which comprises compounds having an epoxy group and is laminated on the adhesive layer 12b. The support base material 12a is constituted by an ionomer resin, where an ethylene-(meta) acrylic acid binary copolymer or an ethylene-(meta) acrylic acid-(meta) acrylic acid alkyl ester terpolymer are cross-linked by a metal ion, and weight fraction of the (meta) acrylic acid component in the copolymer is 1% or more and less than 10%, and neutralization degree of the (meta) acrylic acid in the ionomer resin is 50% or more.

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