RESIN COMPOSITION FOR CARRIER FILM AND CARRIER FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD THEREBY

摘要

PURPOSE: A resin composition for protective film and a protective film for flexible circuit board are able to minimize surface pollution during circuit printing process and increase in adhesion during high temperature compression process. CONSTITUTION: A resin composition for protective film comprises acryl type resin having a hydroxyl functional group and isocyanate type hardener. The 100.0 parts by weight of an acryl type resin comprises hardening compounds of 4-11 parts by weight of a toluene diisocyanate group and a hexamethylene diisocyanate group hardening compound. The hardening compound has 1:0.5-1:6 ratios of the toluene diisocianate group and the hexamethylen diisocyanate group. A protective film for flexible circuit board comprises a base film and an adhesive layer spread on one side or both sides of the base film.