发明名称 |
Substrate for mounting a semiconductor element thereon and semiconductor device comprising a semiconductor element mounted on said substrate |
摘要 |
A retaining substrate for mounting a semiconductor element thereon, having a circuit pattern for said semiconductor element, characterized in that said substrate comprises an insulative material, said substrate has a surface configuration having a cross section comprising (a) an uneven shaped portion and (b) a concave shaped portion which are arranged in tandem wherein a surface of said uneven shaped portion (a) makes a bottom face of said concave portion (b), and said uneven shaped portion (a) has a structure in that (a-i) an insulative convex shaped portion and (a-ii) an insulative concave shaped portion are alternately arranged so as to neighbor with each other, and said circuit pattern is provided in said concave shaped portion (a-ii) of said uneven shaped portion (a).
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申请公布号 |
US2002167064(A1) |
申请公布日期 |
2002.11.14 |
申请号 |
US20010025561 |
申请日期 |
2001.12.26 |
申请人 |
TAKEYAMA YOSHIFUMI;KATAOKA ICHIRO;YAMADA SATORU |
发明人 |
TAKEYAMA YOSHIFUMI;KATAOKA ICHIRO;YAMADA SATORU |
分类号 |
H05K1/02;H01L27/01;H01L27/12;H01L31/00;H01L31/042;H01L31/048;H01L31/052;(IPC1-7):H01L31/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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