| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily part a brittle material substrate such as a sapphire substrate even with a comparatively large thickness without scattering materials, easily handle the substrate, and prevent deterioration of a characteristic of an element formed on the substrate. <P>SOLUTION: This laser processing method for parting a brittle material substrate by radiating pulse laser light beams includes a first step and a second step. In the first step, the pulse laser lights with a predetermined repetition frequency are radiated so that a condensing point is positioned inside the brittle material substrate so as to form a modified layer 12 inside the brittle material substrate. The pulse laser lights are scanned along a parting schedule line, so that cracks with a length not reaching a first main face are made to travel from the modified layer 12 toward the first main face of the brittle material substrate. In the second step, a second main face of the brittle material substrate is polished while leaving the cracks, so as to remove the modified layer 12. <P>COPYRIGHT: (C)2012,JPO&INPIT |
