发明名称 CONDUCTOR GRID FOR ELECTRONIC HOUSINGS AND MANUFACTURING METHOD
摘要 With the present invention, conductor grids for electronic housings and a manufacturing method for such conductor grids are provided. According to the invention, the conductor grid is produced from two metal strips (130, 110, 140) welded along the joint edge (150), with only one of the two metal strips needing to have a surface suitable for the wire bonding. The amount of the conventionally used, plated starting material can be considerably reduced in this way.
申请公布号 EP2417842(A1) 申请公布日期 2012.02.15
申请号 EP20100713158 申请日期 2010.03.29
申请人 TYCO ELECTRONICS AMP GMBH 发明人 BERCHTOLD, LORENZ
分类号 H05K3/20;H01L23/495 主分类号 H05K3/20
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