| 摘要 |
PROBLEM TO BE SOLVED: To suppress a decrease in reliability of a thermal cycle by restraining the occurrence of warpage when forming a unit for mounting power elements even if a cooler is brazed onto the back of a ceramics plate directly. SOLUTION: In the unit 14 for mounting power elements, a circuit layer 12 is brazed onto the surface of the ceramics plate 11, and a cooler 13 where a cooling channel 13a is formed inside is brazed onto the back. The circuit layer 12 is made of an Al alloy having an entire, average purity of≥98.0 wt.% and≤99.9 wt.%, the concentration of Fe contained at the side of brazing surface 12a with the ceramics plate 11 is less than 0.1 wt.%, and the concentration of Fe contained at the side of a surface 12b opposite to the brazing surface 12a is≥0.1 wt.%. COPYRIGHT: (C)2008,JPO&INPIT |
