| 摘要 |
PROBLEM TO BE SOLVED: To suppress connection failure while miniaturizing a circuit module. SOLUTION: A land 12 is formed on the upper face of a mother board 2. A land 11 is formed on the lower face of a module substrate 3 mounted on the mother board 2. A metallic body 5 is arranged between the mother board 2 and the module board 3, and solder-joined to the lands 11 and 12. Thus, the land 11 and the land 12 are electrically connected. The metallic body 5 is provided with a melting point which is higher than that of solder used for solder joining. COPYRIGHT: (C)2008,JPO&INPIT
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