发明名称 SEMICONDUCTOR DEVICE AND REPAIRING METHOD FOR ITS SIDE WALL
摘要 PROBLEM TO BE SOLVED: To enable the side wall of a layer formed in contact with an insulating film to be selectively restored. SOLUTION: The Y-direction width of the lower part of a first conductive layer 6 becomes narrower than the Y-direction width of the upper part, because the side wall of the first conductive layer 6 is subjected to etching or the reaction product of the etching is removed. Thereafter, an outer wall 6b is formed through a selective growth technology in the region where the side wall is removed. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008028098(A) 申请公布日期 2008.02.07
申请号 JP20060198237 申请日期 2006.07.20
申请人 TOSHIBA CORP 发明人 NAKAJIMA TAKAHITO;NAGANO HAJIME;FURUHATA TAKEO;SEKIHARA AKIKO
分类号 H01L21/8247;H01L21/3205;H01L27/115;H01L29/423;H01L29/49;H01L29/788;H01L29/792 主分类号 H01L21/8247
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