Epoxy composition, adhesive film, dicing die bonding film and semiconductor device,申请号KR20090035543-传众专利搜索

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发明名称	Epoxy composition, adhesive film, dicing die bonding film and semiconductor device
摘要
申请公布号	KR101114360(B1)	申请公布日期	2012.02.10
申请号	KR20090035543	申请日期	2009.04.23
申请人		发明人
分类号	C08L63/00;C08G59/00;C08J5/18;C09J163/00	主分类号	C08L63/00
代理机构		代理人
主权项
地址

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