发明名称 ANISOTROPIC CONDUCTIVE FILM AND METHOD OF MANUFACTURING CONNECTING STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive film which can offer both a good connection reliability and repairability in making an anisotropic conductive connection between substrate terminals and electronic component terminals. <P>SOLUTION: An anisotropic conductive film is obtained by forming a resin composition including a film forming resin, a curable liquid compound, conductive particles, an elastomer, and a curing agent into a film. After curing, the film has a storage elastic modulus (25&deg;C) determined by a dynamic viscoelasticity measurement in a tensile vibration mode according to JIS K7244-4 of 0.5 to 1.5 GPa. The elastomer has a breaking strength of 50 to 80 MPa, and a breaking elongation of 10% or less according to ASTM D638. The content of the elastomer in the resin composition is 20 to 50 mass% of a total mass of the film forming resin, the curable liquid compound, the conductive particles, the elastomer and the curing agent. The conductive particles to be used have a compression hardness at 10% displacement of 300 to 500 kgf/mm<SP POS="POST">2</SP>under the conditions of a load of 49.035 mN and a load speed of 2.226 mN/sec. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012028334(A) 申请公布日期 2012.02.09
申请号 JP20110195290 申请日期 2011.09.07
申请人 SONY CHEMICAL & INFORMATION DEVICE CORP 发明人 ARAKI YUTA;DEGUCHI SHINGO;MIYAUCHI KOICHI
分类号 H01B5/16;C09J4/02;C09J5/06;C09J9/02;H01L21/60 主分类号 H01B5/16
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