| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid state imaging apparatus capable of suppressing malfunction of signal processing of a solid state imaging element, while reducing failure that occurs at four corners of a picked-up image. <P>SOLUTION: In a solid state imaging apparatus 10, an area located at a more inner side than an adhesion part 25 of a solid state imaging element 22 is curved towards a wiring substrate 21, while an area other than the above area is flat and an area where a light-receiving part 22a is formed is partially curved. <P>COPYRIGHT: (C)2012,JPO&INPIT |
