| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board and a multilayer printed wiring board capable of electrically connecting a part of a conductor wiring provided in each of laminated printed wiring board with each other, reducing a manufacturing cost, and simplifying a manufacturing process. <P>SOLUTION: A manufacturing method of a multilayer printed wiring board 1 comprises: a step of forming a through hole in a base material 11; a step of forming a plating protrusion part 21 provided to protrude to the surface of a conductor in a plating method; a wiring formation step of forming a conductor wiring 12a where the plating protrusion part 21 is provided by the conductor provided in the base material 11; and a step of connecting the opposed plating protrusion part 21 and a part of a conductor wiring 32a by laminating a printed wiring boards 1a and 1b via anisotropic conductive adhesive 40. The plating protrusion part 21 is simultaneously formed with the plating part 18 formed in the inner face of the open hole. The plating protrusion part 21 is provided in the prescribed region of the conductor wiring 12a in a longitudinal direction of the conductor wiring 12a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
