| 摘要 |
PROBLEM TO BE SOLVED: To provide a treatment method for a silicon substrate in which a recessed portion or groove can be formed on the silicon substrate relatively easily, and a manufacturing method of a liquid injection head. SOLUTION: A protective film 51 is formed on a surface of the silicon substrate, a surface layer of the protective film 5 is processed by irradiation with laser light to form a processed portion 52 in an area where a recessed portion 115 is formed, and the silicon substrate where the protective film 51 having the processed portion 52 is dipped in an etchant to form the recessed portion 115 on the silicon substrate. COPYRIGHT: (C)2009,JPO&INPIT
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