| 摘要 |
An object of the invention is to provide a piezoelectric device in which miniaturization of its plane size is possible and the resonance design of a TAB tape is readily performed. Further, another object of the invention is to provide a piezoelectric device which can surely seal a seal hole. A piezoelectric device 10 is constructed so that: an IC chip 14 is mounted on an inner bottom surface of a package; a piezoelectric vibrating reed 16 is electrically and mechanically connected onto a TAB tape 32 in which a lead is provided on a surface of a resin tape; and the TAB tape 32 to which the piezoelectric vibrating reed 16 has been joined is mounted in the package, whereby the piezoelectric vibrating reed 16 is arranged above the IC chip 14. |
