| 摘要 |
PURPOSE: A substrate grinding apparatus and a method thereof are provided to reduce a tack time of a process because edges of several substrates are settled on both ends of a grinding apparatus and the edges of the several substrates are consecutively polished. CONSTITUTION: A substrate grinding apparatus(1) comprises a table(10) and a grinding unit(20). The substrates are mounted on both sides of the front through first and second mounting portions(11,12) of a table. The grinding apparatus is arranged on the top of the table. The grinding apparatus simultaneously polishes edges of the substrates mounted on the first and second mounting portions. |
