| 摘要 |
PROBLEM TO BE SOLVED: To provide an in-line film forming apparatus wherein processing irregularity is prevented from being caused when reactive plasma processing or ion radiation processing is applied to a substrate held on a carrier. SOLUTION: A carrier 25 includes a holder 28 provided with a hole part 29 with the substrate arranged on the inner side thereof and a plurality of supporting members 30 attached to the peripheral part of the hole part 29 of the holder 28 so as to be elastically deformed, wherein the substrate inserted in the inner side of the supporting members 30 is freely attachably and detachably held while an outer peripheral part of the substrate is abutted on the plurality of supporting members 30. In a chamber performing reactive plasma processing or ion radiation processing to the substrate held on the carrier 25, ring members 32 having aperture parts 32a in a position corresponding to the substrate are disposed oppositely to at least one surface or both surfaces of the substrate held on the carrier 25 and a negative potential is applied to the ring members 32 and the holder 28 is grounded. COPYRIGHT: (C)2010,JPO&INPIT
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