| 发明名称 |
CONTACT TERMINAL STRUCTURE |
| 摘要 |
A contact terminal structure includes: a first plating layer formed on a surface of a substrate; and a second plating layer formed on a surface of the first plating layer as an outermost layer, in which the first plating layer is composed of a silver-tin alloy, the second plating layer is silver plating or an alloy essentially consisting of silver, the first plating layer has a hardness greater than the second plating layer, and the first plating layer has a Vickers hardness of 250 to 400 and the second plating layer has a Vickers hardness of 80 to 200. |
| 申请公布号 |
US2016172069(A1) |
申请公布日期 |
2016.06.16 |
| 申请号 |
US201414897604 |
申请日期 |
2014.05.29 |
| 申请人 |
KANZACC CO., LTD. |
发明人 |
SUMIYA Yoshinori;SEGAWA Isao |
| 分类号 |
H01B1/02;B32B15/01 |
主分类号 |
H01B1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A contact terminal structure comprising:
a first plating layer formed on a surface of a substrate and composed of a silver tin alloy; and a second plating layer formed on a surface of the first plating layer and essentially consisting of silver and an alloy including at least one kind of component selected from selenium and antimony, the first plating layer having a Vickers hardness of 250 to 400 and the second plating layer having a Vickers hardness of 80 to 200. |
| 地址 |
Osaka JP |
