Improvements in or relating to pcb-mounted integrated circuits

摘要

A method and apparatus (20) for testing the mounting of an integrated circuit (16) on a printed circuit board (12) using a ball grid array comprises measuring the change in height, or drop, of the integrated circuit (16) relative to the printed circuit board (12) following soldering of the ball grid array and comparing the measured drop with a predetermined range. The integrated circuit is deemed to have been successfully mounted to the printed circuit board if the change in height falls within the predetermined range.