摘要 |
Procedure for making an article containing a security element e.g. an electronic chip (4) consists of forming a cavity (3) for the chip in a base layer (2) and inserting the chip by means of a carrier layer (5) of a plastic, metal or fibrous material. The depth of the cavity can be equal to or greater than that of the chip, or it can be shallower so that the position of the chip can be detected by touch. |