Light Emitting device package and method of fabricating thereof

摘要

PURPOSE: A light emitting device package and a manufacturing method thereof are provided to improve optical extraction efficiency by forming high refractive index silicon on an LED chip and reducing refraction index difference with the LED chip. CONSTITUTION: A plurality of light emitting diode chips(50) is mounted on a reflector. A first lead frame(120a) and a second lead frame(120b) are formed on the reflector. A silicon film(70) is formed in order to cover the surface of the light emitting diode chip by using a first dispenser. A refractive index of the silicon film is more than 1.6. The thickness of the silicon film is less than 10micrometer. A fluorescent substance film(80) is formed in order to cover the silicon film by using a second dispenser. Mold materials are formed in a mounting region of the light emitting diode chip.