摘要 |
Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without performing a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs. |
申请人 |
LG INNOTEK CO., LTD.;SEO, YEONG UK;KIM, JIN SU;LEE, SANG MYUNG;YOON, SUNG WOON;NAM, MYOUNG HWA;KIM, BYEONG HO |
发明人 |
SEO, YEONG UK;KIM, JIN SU;LEE, SANG MYUNG;YOON, SUNG WOON;NAM, MYOUNG HWA;KIM, BYEONG HO |