LED PACKAGING STRUCTURE AND PACKAGING METHOD THEREOF

摘要

An Light Emitting Diode (LED) packaging structure and a packaging method thereof are provided. The packaging structure comprises a substrate(10), an LED chip(20), one or more convex walls(30) and a colloid lens(40) the shape of which is defined by the convex wall(30). The convex wall(30) is arranged on the substrate(10). At least an LED chip(20) is mounted in an area of the substrate(10), which is surrounded by the convex wall(30). The colloid lens(40) covering the LED chip(20) is also arranged in the area surrounded by the convex wall(30). The colloid lens(40) is obtained by supplying liquid colloid in the area defined by the convex wall(30), forming the required shape by the surface tension of the liquid, curing and shaping.