发明名称 |
SILANOL CONDENSATION CATALYST, THERMOSETTING SILICONE RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR SEALING USE, AND SEALING BODY USING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting silicone resin composition for optical semiconductor sealing use having excellent heat resistance and thin film curability. <P>SOLUTION: A silanol condensation catalyst contains at least an organohafnium compound represented by formula (1) and/or formula (2) in (C). The thermosetting silicone resin composition for optical semiconductor sealing use contains: (A) 100 pts.mass of an organopolysiloxane having two or more silanol groups per molecule; (B) 0.1-2000 pts.mass of a silane compound having two or more alkoxy groups per molecule; and (C) the organohafnium compound. A sealing body using the thermosetting silicone resin composition is also provided. In the formula (1), n is an integer of 1-4, R<SP POS="POST">1</SP>is a hydrocarbon group, and R<SP POS="POST">2</SP>is a 1-18C alkyl group. In the formula (2), m is an integer of 1-4, R<SP POS="POST">2</SP>is a 1-18C alkyl group, and R<SP POS="POST">3</SP>and R<SP POS="POST">4</SP>are each a 1-18C hydrocarbon group or alkoxy group and are the same as or different from each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012021118(A) |
申请公布日期 |
2012.02.02 |
申请号 |
JP20100162045 |
申请日期 |
2010.07.16 |
申请人 |
YOKOHAMA RUBBER CO LTD:THE |
发明人 |
TAKEI YOSHIHITO;ISHIKAWA KAZUNORI;SAIKI TAKEAKI |
分类号 |
C08L83/06;C08K5/09;C08K5/54;H01L23/29;H01L23/31;H01L31/00 |
主分类号 |
C08L83/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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