| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for joining electronic components which make it possible to strengthen the bond of electronic components joined to a circuit board and also secure the quality of conductivity. <P>SOLUTION: Prior to a pressure joining process for thermocompression bonding a flexible circuit board 11 to a rigid circuit board 1, a preliminary heating process is carried out which involves heating a resin adhesive 4 containing a thermosetting resin 4a supplied on the rigid circuit board 1 to a temperature at which an activator exhibits oxide film removing capability, thereby removing by transpiration either or both of a moisture content 4d and a solvent component 4c contained in the resin adhesive 4. This makes it possible both to prevent the occurrence of voids due to moisture contents and solvent components, and to increase the capture rate of solder grains to terminals and the solder wettability to the terminals. Thus, it is made possible to strengthen the bond of the flexible circuit board 11 joined to the rigid circuit board 1 and also secure the quality of conductivity. <P>COPYRIGHT: (C)2012,JPO&INPIT |
