| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing die bond film which has a dicing film having an adhesive layer on a base material and a die bond film formed on the adhesive layer, and can exert good holding power and good detachability for a semiconductor wafer with good balance during dicing. <P>SOLUTION: A dicing die bond film comprises a dicing film 11 having an adhesive layer 2 on a base material 1 and a die bond film 3' formed on the adhesive layer 2, the adhesive layer 2 contains a cured material of a polymer P by ultraviolet irradiation, a polymer A comprising monomer component containing an acrylic ester as a main monomer and an oxazoline group-containing monomer reacts with a carboxyl group-containing compound B containing a carboxyl group and radical reactive carbon-carbon double bond to obtain the polymer P, and the die bond film 3' contains an epoxy resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
