| 摘要 |
<p>The present invention is capable of peeling, from a substrate, a material layer formed on the substrate without generating cracks in the material layer. In order to peel the material layer from the substrate at an interface between the substrate (1) and the material layer (2), pulsed laser light (L) is applied, through the substrate (1), to a work (3) having the material layer (2) formed on the substrate (1), while constantly changing the irradiation region with respect to the work (3), in such a manner that the adjacent irradiation regions overlap each other on the work (3). The region where the pulsed laser light (L) is applied to the work (3) is set to satisfy the relationship of S/L=0.125, where S (mm2) is the area of the irradiation region, and L (mm) is the circumferential length of the irradiation region. Consequently, the material layer can be reliably peeled from the substrate without generating cracks in the material layer formed on the substrate.</p> |
