| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for circuit substrate, capable of attaining manufacturing cost reduction and prevention of cost increases. <P>SOLUTION: The manufacturing method includes a wiring cutting process of cutting portions 2a, 2b, 2c, 2d of wiring in a division process of a general-purpose circuit substrate 11 by cutting a connected portion 5. <P>COPYRIGHT: (C)2012,JPO&INPIT |
