发明名称 |
Integrated circuit package system |
摘要 |
An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the opening; and forming an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer.
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申请公布号 |
US8102666(B2) |
申请公布日期 |
2012.01.24 |
申请号 |
US20080194506 |
申请日期 |
2008.08.19 |
申请人 |
PARK HYUNGSANG;YOON IN SANG;YANG DEOKKYUNG;PARK SOO-SAN;STATS CHIPPAC LTD. |
发明人 |
PARK HYUNGSANG;YOON IN SANG;YANG DEOKKYUNG;PARK SOO-SAN |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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