| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component transport method which keeps a high alignment accuracy for a head taking out a bare chip or for other components. <P>SOLUTION: In a component transport method, a bare chip supported on a wafer stage 20, which is movable only in a Y axis direction, is recognized as an image by a movable camera 50, then lifted up by a lifting head 30 movable only in an X axis direction, and the bare chips are retained and transported by wafer heads 42a and 42b. The method includes: before the above operation, a step of capturing an image of a mark provided on the wafer stage 20 by the movable camera 50; a step of determining, based on the result of the wafer stage image, a first reference coordinate in the X axis direction for moving the movable camera 50; a step of capturing an image of a mark provided on the lifting head 30 by the movable camera 50; a step of determining a second reference coordinate in the Y axis direction for moving the movable camera 50 and a third reference coordinate for moving the lifting head 30 based on the result of the lifting head image; and a step of determining a fourth reference coordinate for moving the wafer stage 20 based on both results of the images. <P>COPYRIGHT: (C)2012,JPO&INPIT |
